On 12–13 November, Kaunas University of Technology (KTU) will host the international conference “ELECTRONICS 2026: From SMT to Advanced Packaging – Manufacturing Meets Microinterconnects”, bringing together experts in microelectronics, electronics manufacturing, semiconductor packaging, and advanced electronic systems from both academia and industry.
The conference aims to strengthen collaboration between the academic community and industry, foster knowledge exchange, and encourage discussions on the latest developments and future directions in electronics technologies.
The 29th International Conference ELECTRONICS 2026 brings together SMT engineers, advanced packaging researchers, reliability specialists, researchers, students, and representatives of the electronics and semiconductor industries to exchange knowledge, foster collaboration between academia and industry, and explore the latest advances in heterogeneous integration, microinterconnects, and advanced electronics technologies.
The programme will feature presentations by international experts, student sessions, discussions, and networking events. Participants will have the opportunity to explore the latest research findings and technological trends, establish new professional connections, and discuss the future prospects of microelectronics in Europe.
More information: electronicsconf.ktu.edu
