International Conference ELECTRONICS 2026: From SMT to Advanced Packaging – Manufacturing Meets Microinterconnects

Conference

Organized by Kaunas University of Technology, the conference serves as a platform for collaboration and discussion among representatives from academy, industry, and business.

Partners:

TUD IAFT (Dresden University of Technology, Institute of Electronic Packaging Technology)
IHP (IHP GmbH, Leibniz Institute for High Performance Microelectronics)
Industry Partners: FINETECH, TELTONIKA, etc.

Location: KTU, Kaunas, Lithuania

Tentative Timing: 12–13 November 2026

Day 1: ChipsC2-LT conference

Day 2: TiFEC conference

General Chair

Prof., Dr. Mindaugas ŽILYS (Kaunas University of Technology / Kaunas, LITHUANIA)

Executive Chair

Dr. Agata ROMANOVA (Kaunas University of Technology / Kaunas, LITHUANIA)

Co-Chairs

Prof., Dr. Algimantas VALINEVIČIUS (Kaunas University of Technology / Kaunas, LITHUANIA)
Prof., Dr. Darius ANDRIUKAITIS (Kaunas University of Technology / Kaunas, LITHUANIA)
Prof., Dr. Dangirutis NAVIKAS (Kaunas University of Technology / Kaunas, LITHUANIA)

Conference Vision

A joint platform connecting SMT engineers, advanced packaging researchers, reliability specialists, and industry to build a shared technical language, bridge research and manufacturing, and grow German-Baltic collaboration around heterogeneous integration and microinterconnects.

Key Topic:

SMT & Manufacturing Integration

Advanced SMT process integration
Fine-pitch assembly & microinterconnect technologies
Process optimization, automation & inspection quality

Advanced Packaging

3D heterogeneous integration & wafer-level packaging
System-in-Package (SiP), bare-die integration
Photonic packaging
Packaging for power electronics

Reliability & Materials

Reliability and failure mechanisms (incl. laser-related)
SSIL-enabled SiP interconnect reliability
Reliability-driven design & qualification strategies
Materials/interfaces & non-destructive evaluation

Emerging & Cross-Cutting Technologies

Edge AI and embedded intelligence
AI-assisted electronics design, manufacturing and inspection
Smart sensors and IoT
Flexible & stretchable electronics
MEMS & NEMS
Energy harvesting

Power Electronics & Intelligent Electronic Systems

Si, SiC and GaN power electronics
Advanced packaging and integration for power electronics
Intelligent control, monitoring and digital twins for power electronic systems
AI/ML for power electronics and energy-efficient systems
Reliability and thermal management

2D Materials in Electronics

Graphene-focused device and integration research
2D-material interfaces in packaging/reliability contexts

Integrated Circuit (IC) Design & Design Technologies

Analog, mixed-signal and RF IC design
Digital and low-power IC design
IC design for sensing, edge AI and embedded applications
Design–technology co-optimization
Open-source IC design flows, EDA tools and PDKs
Design for advanced packaging and heterogeneous integration

Open Source in Microelectronics

Open-source design and technology flows
Promoting open-source microelectronics ecosystems in the EU

Strategic / Panel Themes

Future of Advanced Packaging and Microelectronics in Europe
Manufacturing Challenges in Heterogeneous Integration
Building a Baltic Microelectronics & Semiconductor Ecosystem
Role and cooperation of Chips Competence Centres in the Baltic States
Industry–academia–research institute cooperation
Joint Baltic/German participation in Chips JU and Horizon Europe projects
Researcher, PhD and student exchange

Agenda

Day 1

Day 1: ChipsC²-LT conference – Theory, Research & Industrial Perspective

Morning

Opening Session (start 08:30)

Welcome from TUD IAFT, KTU, IHP (30 min)

Keynote Sessions: Industry (3 x 30 min)

2-3 presentations from industrial partners (e.g. from FINETECH, Teltonika, 8devices, SiFemto,..)

Coffee break 10:30 + networking. Industry showroom + result presentation (90 min).

Keynote Sessions 12:00–13:00: Universities/Research 1 (2 x 30 min)

From Microinterconnects to Systems: Advanced Packaging Technologies for HPC and AI – Prof. Dr.-Ing. Juliana Panchenko. Dresden University of Technology, Institute of Electronic Packaging Technology.
Space-grade Opto-Electronic Interfaces for Satellite Payloads – Dr.-Ing. Philip Ostrovskyy, Group Leader, Circuit Design / Converters & High-Speed Logic Circuits. IHP GmbH, Leibniz Institute for High Performance Microelectronics.

Lunch 13:00–14:00

Keynote Sessions 14:00–16:00: Universities/Research 2 (4 x 30 min)

EDI, Latvia – invited talk. Topic to be agreed with EDI: power electronics / Edge AI / open-source silicon / European semiconductor initiatives
Presentation by KTU
Presentation by FMTC + Chip Competence Center LT
Co-Packed Optics Technologies at IAVT-TUD: Multi-Lithography Process Development for Polymeric Optics Integration in Electronic Systems – Dr. Krzysztof Nieweglowski, Research Group Leader Photonics Packaging, Dresden University of Technology, Institute of Electronic Packaging Technology.

Coffee break 16:00 + networking (30 min)

Keynote Sessions 16:30–18:30: Universities/Research 3 (4 x 30 min)

Presentation by Vilnius University (VU)
Presentation by IHP 2 (open-source, photonics, 2D materials, HF design, …)
Presentation by VilniusTech (VGTU)
Integration Technology Development of Radio-Frequency Chips for Flexible Electronics – Ran Yin, Photonics Packaging, Dresden University of Technology, Institute of Electronic Packaging Technology.

Day 1 End: 18:30

Dinner 19:00

Day 2

Day 2: TiFEC conference, Round-Table Discussions

Morning:

08:30–09:30 Student Session: (6 x 10 min or 4x 15 min): open mix: MEMS/NEMS, energy harvesting, AI-assisted inspection, open-source IC design flows, GaN/2D materials student projects, IC Design & Design Technologies

Coffee break 09:30 (30 min)

Tour to Lithuanian Energy Institute 10:00–11:30

Tour to Material Science Institute 11:30–13:00

Lunch 13:00–14:00

Round Table: 14:00–15:00. Baltic-German Microelectronics Cooperation round-table discussion for research and industry participants. Topics for discussion:

Chips Competence Centers: capabilities and opportunities for cooperation
What Lithuania, Latvia and Germany can offer each other
Joint access to research infrastructure and expertise
Open-source silicon and accessible design tools for universities and SMEs
Joint Chips JU / Horizon Europe proposals
Industry needs and technology transfer
PhD/student/researcher mobility
Concrete follow-up actions for 2027

Conference Closing 15:00–15:15

Summary of outcomes
Future cooperation roadmap
Potential follow-up actions and funding opportunities

Tour to Kaunas Old Town 15:30–18:00

The project “Excellence Center of Technological and Physical Sciences (TiFEC)” is funded by the Lithuanian Science Council and the Ministry of Education, Science and Sport of the Republic of Lithuania through the state budget under the programme “University Excellence Initiative”.